ec3smb-8.000m ec3sm b -8.000m series 4.0mm epoxy base smd crystal frequency tolerance/stability 50ppm at 25c, 100ppm over -40c to +85c mode of operation at-cut fundamental nominal frequency 8.000mhz load capacitance 18pf parallel resonant electrical specifications nominal frequency 8.000mhz frequency tolerance/stability 50ppm at 25c, 100ppm over -40c to +85c aging at 25c 5ppm/year maximum load capacitance 18pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 90 ohms maximum mode of operation at-cut fundamental drive level 1mwatts maximum storage temperature range -40c to +85c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 connected to pin 3 3 connected to pin 2 4 crystal line marking 1 e8.000 e=ecliptek designator www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 1 of 3 marking orient a tion 4.95 max 12.5 max 1.3 0.1 (x4) 9.0 0.1 4.0 max 1.2 0.1 2.0 ref 1 2 4 3
ec3smb-8.000m 6.7 1.3 2.2 (x4) 2.3 (x4) www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 2 of 3 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ec3smb-8.000m low temperature infrared/convection 225c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 225c maximum target peak temperature (tp target) 225c maximum 2 times time within 5c of actual peak (tp) 80 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 3 of 3
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